Power chips are connected to outside circuits through product packaging, and their efficiency depends upon the assistance of the packaging. In high-power situations, power...

Power chips are connected to outside circuits through product packaging, and their efficiency depends upon the assistance of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation describes the electrical connection on the upper surface of the chip, which is usually aluminum bonding cord in traditional modules. ^ Typical power module plan cross-section Presently, commercial silicon carbide power components still mostly use the packaging technology of this wire-bonded conventional silicon IGBT component. They deal with problems such as big high-frequency parasitical parameters, insufficient warmth dissipation ability, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these issues...

Power chips are connected to outside circuits through product packaging, and their efficiency depends upon the assistance of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation describes the electrical connection on the upper surface of the chip, which is usually aluminum bonding cord in traditional modules. ^ Typical power module plan cross-section Presently, commercial silicon carbide power components still mostly use the packaging technology of this wire-bonded conventional silicon IGBT component. They deal with problems such as big high-frequency parasitical parameters, insufficient warmth dissipation ability, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these issues...