Heat conduction aluminum nitride is prepared by laser flame jet fusion method. The obtained product has high purity, uniform particle size distribution, clean surface, high sphericity, no residual impurities, easy dispersion, and good compatibility with organisms. Heat conduction aluminum nitride undergoes the second laser melting spherical alloying, and has a high thermal conductivity (340W) and heat transfer. The powder treated by surface modification will not undergo hydrolysis reaction. The oxygen content is extremely low (<0.1%), and the insulation and thermal conductivity effect is very obvious. Used in polymer resins, the viscosity is not obvious, and it is currently a good high thermal conductivity insulating filler.
Heat conduction aluminum nitride was first synthesized in 1877. In the 1980s, Heat conduction aluminum nitride was a ceramic insulator and Heat conduction aluminum nitride had a high heat transfer capacity, so that Heat conduction aluminum nitride was widely used in microelectronics. Unlike beryllium oxide, Heat conduction aluminum nitride is non-toxic. Heat conduction aluminum nitride is treated with metal, which can replace alumina and beryllium oxide in a large number of electronic instruments. Heat conduction aluminum nitride can be prepared by the reduction of aluminum oxide and carbon or directly nitriding metal aluminum. Heat conduction aluminum nitride is a substance connected by covalent bonds. It has a hexagonal crystal structure, which is the same shape as zinc sulfide and wurtzite. Industrial-grade materials can only be manufactured by hot pressing and welding. The substance is very stable in an inert high temperature environment.
1. After the second laser melting, spherical alloying, The Heat conduction aluminum nitride has uniform size, good fluidity, improve the thermal conductivity and insulation of the material;
2. After the Heat conduction aluminum nitride is melted, the surface is treated with anti-hydrolysis and anti-oxidation, and the thermal conductivity will exist for a long time after adding;
3. Heat conduction aluminum nitride has good injection molding properties; used in composite materials, it has good matching with semiconductor silicon and good interface compatibility, which can improve the mechanical properties and thermal conductivity of composite materials;
4. Application in high thermal conductivity plastics: The modified Heat conduction aluminum nitride can greatly improve the thermal conductivity of the plastic. Currently mainly used in PVC plastics, polyurethane plastics, PA plastics, PP plastics, functional plastics, etc.
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