Power chips are connected to outside circuits through product packaging, and their efficiency depends upon the assistance of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip affiliation describes the electrical connection on the upper surface of the chip, which is usually aluminum bonding cord in traditional modules. ^
Typical power module plan cross-section
Presently, commercial silicon carbide power components still mostly use the packaging technology of this wire-bonded conventional silicon IGBT component. They deal with problems such as big high-frequency parasitical parameters, insufficient warmth dissipation ability, low-temperature resistance, and inadequate insulation stamina, which restrict the use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these issues and fully make use of the substantial prospective benefits of silicon carbide chips, many brand-new product packaging technologies and services for silicon carbide power components have actually arised over the last few years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually created from gold cables to copper cables, and the driving pressure is expense reduction; high-power gadgets have actually established from aluminum wires (strips) to Cu Clips, and the driving force is to enhance item efficiency. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to standard bonding packaging techniques, Cu Clip innovation has the complying with benefits:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a specific degree, changes the common cable bonding technique between the chip and the pins. For that reason, a special plan resistance worth, higher present flow, and much better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can fully save the price of silver plating and inadequate silver plating.
3. The product look is completely regular with typical items and is generally used in web servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and other areas.
Cu Clip has 2 bonding approaches.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding method is more costly and complex, yet it can attain far better Rdson and much better thermal effects.
( copper strip)
Copper sheet plus cable bonding approach
The source pad uses a Clip method, and the Gate utilizes a Cord method. This bonding technique is a little more affordable than the all-copper bonding method, conserving wafer area (appropriate to extremely tiny entrance areas). The process is simpler than the all-copper bonding approach and can get better Rdson and better thermal impact.
Distributor of Copper Strip
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